Skip to content

Independent project. Not a U.S. government website.

USASI

Job at Broadcom

R&D Process Engineer

Employer
Broadcom
Location
Singapore-Yishun
Workplace
Not supplied
Employment
full-time
Published
First listed on USASI

Apply on Broadcom’s site (external site)

This posting comes from Broadcom’s own Workday job board. USASI checks that board twice a day and removes this page once the employer closes the posting. The description below is Broadcom’s text as published; USASI does not edit it, does not recruit, and does not take applications. How jobs are collected.

Job description

Please Note:

1. If you are a first time user, please create your candidate login account before you apply for a job. (Click Sign In > Create Account)

2. If you already have a Candidate Account, please Sign-In before you apply.

Job Description:

  • Responsible for the design and implementation of packaging processes for new isolation products.
  • Evaluate material reliability, material properties, and processing techniques, while exploring new production methodologies for manufacturing.
  • Conduct Design of Experiments (DOE) and optimize newly developed processes.
  • Collaborate with IC designers, product engineers, manufacturing teams, support functions, and contract manufacturers to develop and validate new device processes through R&D programs.
  • Perform process yield analysis and failure investigations for new device-related issues.
  • Plan and execute engineering programs to achieve cost reduction targets and drive breakthrough improvements in manufacturing yield, quality, and reliability.

Requirement:

  • We are seeking an experienced R&D Process Engineer specializing in Optocoupler products.
  • Strong background in Mechanical Engineering and semiconductor packaging process development.
  • Hands-on experience in processes such as Die Attach, Wire Bonding, Encapsulation/Molding, Package Trim & Form, and Vision Inspection tools.
  • Demonstrated analytical and critical thinking skills with strong problem-solving capabilities and a solution-oriented mindset.
  • Familiarity with mechanical leadframe design rules/tools and knowledge of semiconductor physical failure analysis.
  • Experience in IC packaging, high-voltage isolation requirements, materials, and processing techniques.
  • Experience leading NPI projects and taking products from verification/qualification through high-volume soft launch is an advantage.
  • Experience in Solidworks/ Ansys, CAD and simulation tools

Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.

If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.

Apply on Broadcom’s site (external site)

Similar jobs

Support Us

Help keep USASI useful.

Optional. No USASI account required. Payment takes place on the linked provider’s website (Buy Me a Coffee).

About supporting this project