Job at Broadcom
Wafer Qualification, Reliability and Failure Analysis Engineering
- Employer
- Broadcom
- Location
- Singapore-Depot Road · Singapore-Senoko
- Workplace
- Not supplied
- Employment
- full-time
- Published
- First listed on USASI
This posting comes from Broadcom’s own Workday job board. USASI checks that board twice a day and removes this page once the employer closes the posting. The description below is Broadcom’s text as published; USASI does not edit it, does not recruit, and does not take applications. How jobs are collected.
Job description
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Job Description:
- Provide leadership and insights into root cause of device failures via in-depth failure analysis using intricate tools and state of the art equipment.
- Collaborate with product engineering and R&D team to translate findings into solutions for new design improvements.
- Monitor and use big data analysis on long term wafer reliability performance and propose improvements to product design or manufacturing process changes.
Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.
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