Job at NVIDIA
Senior Package Layout Engineer
- Employer
- NVIDIA
- Location
- Taiwan, Hsinchu
- Workplace
- Not supplied
- Employment
- full-time
- Published
- First listed on USASI
This posting comes from NVIDIA’s own Workday job board. USASI checks that board twice a day and removes this page once the employer closes the posting. The description below is NVIDIA’s text as published; USASI does not edit it, does not recruit, and does not take applications. How jobs are collected.
Job description
NVIDIA have some of the most forward-thinking and hardworking people in the world working for us and, due to unprecedented growth, our exclusive engineering teams are rapidly growing. If you're a creative and autonomous engineer with a real passion for technology, we want to hear from you.
NVIDIA IC Packaging design team is looking for a Senior IC Packaging Design Engineer to join our package team and focus on delivering and designing state of the art high-speed Interconnect systems for Supercomputers and Datacenters. This position will collaborate with Technical Package Lead and cooperation with different design teams and development of complex, detailed layout of IC substrates for NVIDIA products.
What you'll be doing:
- As part of a Package Layout team, you will collaborate to implement high speed and PDN design for ASIC packages.
- Develop symbols, pad stack and perform substrate package routing, placement, stack-up, reference plane, power distribution using APD or SiP tools.
- Optimize package pin out incorporating system level trade-offs of pins assignment.
- Develop methodologies to improve layout environment, productivity, reliability, and schedule considerations.
- In close co-operation with the SI/PI/HW design teams and product teams
- Planning, ensuring stakeholder management and leading projects from start to finish
What we need to see:
- B.Sc. Electrical Engineering or any equivalent experience.
- Minimum of 5+ years hand-on in Package or/and PCB Layout; including high speed design signal integrity practice; PDN designing and planning
- Experience in substrate layout of wire bond and flip chip packages, preferred
- Knowledge in substrates or board manufacturing process
- Significant background with APD or SiP and/or other PCB layout tools
- English communication skills (written and verbal) are required for this role
Ways to stand out from the crowd:
- Knowledge in Ansys (SIwave, HFSS) or Cadence (Sigrity, PowerSI) simulation tools
- Familiarity with Skill language (Cadence) and basic parsing abilities (Python/Perl/Shell-scripting)
We are committed to fostering a diverse work environment and proud to be an equal opportunity employer. As we highly value diversity in our current and future employees, we do not discriminate (including in our hiring and promotion practices) on the basis of race, religion, color, national origin, gender, gender expression, sexual orientation, age, marital status, veteran status, disability status or any other characteristic protected by law.
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