Job at Micron Technology
Director / DMTS, Process Integration Lead – Advanced Packaging (2.5D/3D, HBM, Hybrid Bonding)
- Employer
- Micron Technology
- Location
- Boise, ID - Main Site
- Workplace
- Not supplied
- Employment
- Not supplied
- First listed on USASI
This posting comes from Micron Technology’s own Workday job board. USASI checks that board twice a day and removes this page once the employer closes the posting. The description below is Micron Technology’s text as published; USASI does not edit it, does not recruit, and does not take applications. How jobs are collected.
Job description
The full description is on Micron Technology’s job board (external site).
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