USASI

Organization

Micron Technology

Chip designer · Hardware manufacturer · Boise, Idaho

Micron makes memory and storage products, including DRAM, NAND, and NOR. Its Cloud Memory Business Unit covers memory for large hyperscale cloud customers and high-bandwidth memory (HBM) for all data center customers, and the company markets HBM, low-power server memory modules, and data center SSDs for AI workloads.1246

Last reviewedEntry updated

Key facts

Legal name
Micron Technology, Inc.2
Ownership
Publicly traded
Legal form
Delaware corporation21
Headquarters
Boise, Idaho2
Founded
19783
Sectors
Chips

What is and isn’t public

An evidence-based summary of what this catalog has documented. It is not a verdict on the organization as a whole.

No openness summary has been written for this organization yet.

Products

Documented products and how they are delivered. Each row links to the official page.

No hosted model products are recorded for this organization.

Other products

Micron Technology: other products
ProductKindDocumented delivery and accessReviewed
Micron HBM (HBM3E and HBM4) (external site: micron.com)Hardware3D-stacked DRAM sold for AI accelerators, high-performance computing, and data center workloads; the product page lists HBM4 and HBM3E.54Sep 29, 2026
Micron SOCAMM2 (external site: micron.com)HardwareLow-power LPDDR5X DRAM in a compression-attached, data center-class module form factor, which Micron positions as memory for AI data centers.61Sep 29, 2026
Micron data center SSDs (external site: micron.com)HardwareNVMe and SATA solid-state drives for AI, cloud, enterprise, and hyperscale data center workloads, including the 9650 and 6600 ION product lines.7Sep 29, 2026

Related open artifacts

Records in the Open Models & Tools directory that list this organization as a maintainer or publisher.

No open-artifact records in this catalog list Micron Technology. That is not evidence that none exist — only that none have been reviewed here.

Notable documented facts

  • Micron's annual report states that cloud servers supporting AI and data-centric workloads require increasing amounts of DRAM, including HBM, and NAND. It began volume production of LPDDR5 in a SOCAMM module form factor for servers in 2025.1

U.S. eligibility

How this record meets the catalog’s published eligibility policy.

Eligible · basis: U.S. headquarters

Micron Technology, Inc. is a Delaware corporation with principal executive offices in Boise, Idaho, per the cover page of its Form 10-Q for the quarter ended May 28, 2026.2

Assessed Sep 29, 2026

Eligibility policy

Sources

  1. 1.
    Micron Technology, Inc. Form 10-K for the fiscal year ended August 28, 2025 (external site: sec.gov)

    U.S. Securities and Exchange Commission (EDGAR) · Filing · published Oct 3, 2025 · accessed Sep 29, 2026

  2. 2.
    Micron Technology, Inc. Form 10-Q for the quarter ended May 28, 2026 (external site: sec.gov)

    U.S. Securities and Exchange Commission (EDGAR) · Filing · published Jun 25, 2026 · accessed Sep 29, 2026

  3. 3.
    Our company | Micron Technology Inc. (external site: micron.com)

    Micron Technology · Official page · accessed Sep 29, 2026

  4. 4.
    AI memory and storage | Micron Technology Inc. (external site: micron.com)

    Micron Technology · Official page · accessed Sep 29, 2026

  5. 5.
    High-bandwidth memory (HBM) | Micron Technology Inc. (external site: micron.com)

    Micron Technology · Official page · accessed Sep 29, 2026

  6. 6.
    SOCAMM2 | Micron Technology Inc. (external site: micron.com)

    Micron Technology · Official page · accessed Sep 29, 2026

  7. 7.
    Data center SSD | Micron Technology Inc. (external site: micron.com)

    Micron Technology · Official page · accessed Sep 29, 2026

This listing is not an endorsement or a federal approval.

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