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Sean Lie

Co-founder and CTO of Cerebras; presenter of its wafer-scale engine architecture at Hot Chips

Sean Lie is a co-founder and the CTO of Cerebras, the company that builds wafer-scale processors and systems for AI training and inference. Lie co-founded Cerebras in 2015 with Andrew Feldman, Gary Lauterbach, Michael James and Jean-Philippe Fricker, and has presented the company's wafer-scale architecture at the Hot Chips symposium, including the first Wafer Scale Engine in 2019.1234

Cerebras

Lie is one of the five people Cerebras names as founding the company in 2015 with the aim of bringing wafer-scale computing to market, and the company's leadership page lists Lie as CTO and co-founder. Cerebras's history lists the WSE-1 and CS-1, WSE-2 and CS-2, and WSE-3 and CS-3 generations, followed by the CS-4 system in 2026.1

Technical presentations

Lie has described Cerebras's hardware at the Hot Chips symposium on high-performance chips. In 2019 Lie presented the first Wafer Scale Engine at Hot Chips 31, in 2021 presented "The Multi-Million Core, Multi-Wafer AI Cluster" at Hot Chips 33, and in 2022 gave a deep dive into the Cerebras architecture and its hardware and software co-design at Hot Chips 34.234

Work

Career timeline

  1. 2015

    Co-founded Cerebras with Andrew Feldman, Gary Lauterbach, Michael James and Jean-Philippe Fricker.1

  2. 2019

    Presented the Cerebras Wafer Scale Engine at Hot Chips 31.2

  3. 2021

    Presented "The Multi-Million Core, Multi-Wafer AI Cluster" at Hot Chips 33.3

  4. 2022

    Presented a deep dive into the Cerebras architecture at Hot Chips 34.4

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References · reviewed Oct 22, 2026

  1. 1.
    Cerebras — Company (history and leadership) (external site: cerebras.ai)

    Cerebras · Official page · accessed Oct 22, 2026

  2. 2.
  3. 3.
    Hot Chips 33 (2021) program (external site: hc33.hotchips.org)

    Hot Chips · Official page · published 2021 · accessed Oct 22, 2026

  4. 4.
    Hot Chips 34 (2022) program (external site: hc34.hotchips.org)

    Hot Chips · Official page · published 2022 · accessed Oct 22, 2026

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